Scriba, Manfred RKakaza, Masibulele TMaesela, Maushe EMandiwana, Vusani2025-09-262025-09-262025-092673-4591https://doi.org/10.3390/engproc2025109004http://hdl.handle.net/10204/14421Several approaches to producing lab-on-chip (LOC) devices have been developed in the last 20 years, including laser cutting of acrylic sheets and laminating them with adhesive films. While this route allows for rapid manufacture of devices, it cannot be scaled up beyond a couple of prototypes. For mass production of 3D LOC devices, injection molding is required, but mold manufacturing can be very costly. In this work we briefly report laser cutting parameters and lamination approaches, as well as 3D-printed injection mold inserts that allow one to produce LOC prototypes in facilities that have limited resources. This allows these facilities to transition from a couple of demonstrators to more than 100 devices in a short time and with limited costs.FulltextenLab-on-ChipLOCRapid prototypeLaser cuttingInjection moldingArticlen/a