Bezuidenhout, Petrone HLand, Kevin JJoubert, T-H2017-07-282017-07-282016-11Bezuidenhout, P.H., Land, K.J. and Joubert, T-H. 2016. Integrating integrated circuit chips on paper substrates using inkjet printed electronics. 17th Annual Conference of the Rapid Product Development Association of South Africa (RAPDASA), 2-4 November 2016, Vaal University of Technologyhttp://conferences.sun.ac.za/index.php/rapdasa17/rapdasa17/paper/view/2532http://hdl.handle.net/10204/944317th Annual Conference of the Rapid Product Development Association of South Africa (RAPDASA), 2-4 November 2016, Vaal University of Technology.This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively connect various integrated circuit(IC) chip packages to a paper substrate using a commercially-available conductive silver ink. The verification process included contact resistance compared to line resistance, percentage effective connections, geometry relative to design parameters and frequency characteristics. These parameters are useful in solving integration difficulties and aid the development of electronic networks on paper substrates, providing a clearer understanding of rigid and flexible substrate integration.enCircuit chipsInkjet printed electronicsDimatix DMP-2831 materialConference PresentationBezuidenhout, P. H., Land, K. J., & Joubert, T. (2016). Integrating integrated circuit chips on paper substrates using inkjet printed electronics. http://hdl.handle.net/10204/9443Bezuidenhout, Petrone H, Kevin J Land, and T-H Joubert. "Integrating integrated circuit chips on paper substrates using inkjet printed electronics." (2016): http://hdl.handle.net/10204/9443Bezuidenhout PH, Land KJ, Joubert T, Integrating integrated circuit chips on paper substrates using inkjet printed electronics; 2016. http://hdl.handle.net/10204/9443 .TY - Conference Presentation AU - Bezuidenhout, Petrone H AU - Land, Kevin J AU - Joubert, T-H AB - This paper investigates the integration of silicon and paper substrates using rapid prototyping inkjet printed electronics. Various Dimatix DMP-2831 material printer settings and adhesives are investigated. The aim is to robustly and effectively connect various integrated circuit(IC) chip packages to a paper substrate using a commercially-available conductive silver ink. The verification process included contact resistance compared to line resistance, percentage effective connections, geometry relative to design parameters and frequency characteristics. These parameters are useful in solving integration difficulties and aid the development of electronic networks on paper substrates, providing a clearer understanding of rigid and flexible substrate integration. DA - 2016-11 DB - ResearchSpace DP - CSIR KW - Circuit chips KW - Inkjet printed electronics KW - Dimatix DMP-2831 material LK - https://researchspace.csir.co.za PY - 2016 T1 - Integrating integrated circuit chips on paper substrates using inkjet printed electronics TI - Integrating integrated circuit chips on paper substrates using inkjet printed electronics UR - http://hdl.handle.net/10204/9443 ER -